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Paliney® H3C-HTB

通用系列: Palladium - Wrought - Alloy提供方: Deringer-Ney Inc.
Paliney® H3C, which stands for High-Hardness/High Conductivity, is a patented Palladium, Copper and Silver based alloy designed for applications such as semiconductor test probes where extreme hardness and higher levels of electrical conductivity are required. Paliney H3C is the hardest of the Paliney family of alloys produced to-date by Deringer-Ney. This alloy is designed to be drawn down to wire diameters as fine as 0.001" and to allow secondary processing operations including forming, coining and pointing.
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物料形态
已商用:当前有效
文档
description

Technical Datasheet (English)

下载文档
可用性
北美洲
其他属性
Forms Available, Metal Type, Type Analysis, 密度, Tensile Strength (Ultimate), Tensile Elongation (Break), 硬度, 泊松比, 拉伸模量, Electrical Resistivity, Electrical Conductivity
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加工

Find specific processing information for Paliney® as well as general information for the Palladium - Wrought - Alloy generic family. 注册 登录 了解更多信息。

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