NanoTach® X Series
Product Description
Thick paste of nano-sized silver powder in an organic binder formulation.
Key Features
Applications
Bonding small to large chips (over 10mm x 10mm) for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, RF power devices.
Thick paste of nano-sized silver powder in an organic binder formulation.
Key Features
- Uniform dispersion for screen/stencil printing or dispensing
- Low sintering temperature (<260 °C)
- Excellent sintered properties
- RoHS compliant
Applications
Bonding small to large chips (over 10mm x 10mm) for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, RF power devices.
一般属性
使用 Prospector 建立免費帳戶時，可造訪 NanoTach® X Series 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
description
Technical Datasheet (English)
下载文档可用性
北美洲
其他属性
Forms Available, Metal Type, 密度, 拉伸模量, Mean CTE, 导热系数, Electrical Resistivity
加工
Find specific processing information for NanoTach® as well as general information for the Silver - Powder Metal - Alloy generic family. 注册 或 登录 了解更多信息。
购买地点
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