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HARRIS® DYNAFLOW®

通用系列: Copper - Wrought - Cu-Ag-P Alloy提供方: THE HARRIS PRODUCTS GROUP
Designed for copper or brass applications, Dynaflow is self fluxing on copper but requires use of Stay-Silv® white or black brazing flux when joining brass. Dynaflow mirrors the brazing characteristics of Stay-Silv 15. The melting range is wide enough to alloy filling gaps, necessary to braze loose connections or "cap" a finished joint. When heated to its liquidus temperature the filler metal flows quickly to fill tight gaps or standard connections.

AVAILABLE FORMS:
Standard wire diameters in 20" or 36" lengths, on layer wound spools, formed rings

RECOMMENDED FLUX:
No flux required on copper
Stay Silv white or black brazing flux with brass
一般属性

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物料形态
已商用:当前有效
文档
description

Technical Datasheet (English)

下载文档
可用性
北美洲
其他属性
Forms Available, Metal Type, Type Analysis, Tensile Strength (Ultimate), Tensile Elongation (Break), Electrical Resistivity, Electrical Conductivity
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加工

Find specific processing information for HARRIS® as well as general information for the Copper - Wrought - Cu-Ag-P Alloy generic family. 注册 登录 了解更多信息。

购买地点

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