AIM Specialty 70In/30Pb 数据表

Cast Indium Alloy

用AIM Specialty Materials提供

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产品说明
Solders for Photonic Packaging

AIM's full range of specialty joining materials includes indium and gold/tin solders for photonic packaging applications. When you work with AIM you receive superior products & the technical support you need to produce innovative and reliable packaging solutions. AIM offers a broad range of solders to fulfill your most challenging component packaging applications. We offer solders for:

  • Fiber to Ferrule Soldering
  • Laser Die Attach
  • Hermetic Packaging & Sealing
  • Wetting & Sealing Laser Optics
  • Thermal Management

Solder alloys for photonic packaging applications include indium, gold, bismuth, cadmium and gallium based solder alloys. Please click on any of the above metals to display additional information on their alloys.

The chart below lists a selection of AIM's most commonly specified solder alloys used in photonic packaging applications.
总览  
材料状态 
  • 已商用:当前有效
供货地区 
  • 北美洲
Available Documents
Technical Datasheet (English)
Metals General
额定值
单位制
 
Metal Type
 
 
Metals Type Analysis
额定值
单位制
 
Type Analysis
     
Indium
%
 
Lead
%
 
Metals Physical
额定值
单位制
 
密度
lb/in³
 
Metals Mechanical
额定值
单位制
 
Tensile Strength (Yield), 0.2%
ksi
 
Metals Thermal
额定值
单位制
 
Mean CTE
in/in/°F
 
备注
1一般属性:这些不能被视为规格。
 
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此数据表中的信息由 UL Prospector 从该材料的生产商处获得。UL Prospector 尽最大努力确保此数据的准确性。 但是 UL Prospector 对这些数据值不承担任何责任,并强烈建议在最终选择材料前,就数据值与材料供应商进行验证。