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AIM Specialty 62Sn/Pb36/Ag2

通用系列: Tin - Cast - Alloy提供方: AIM Specialty Materials
Solders for Photonic Packaging

AIM's full range of specialty joining materials includes indium and gold/tin solders for photonic packaging applications. When you work with AIM you receive superior products & the technical support you need to produce innovative and reliable packaging solutions. AIM offers a broad range of solders to fulfill your most challenging component packaging applications. We offer solders for:
  • Fiber to Ferrule Soldering
  • Laser Die Attach
  • Hermetic Packaging & Sealing
  • Wetting & Sealing Laser Optics
  • Thermal Management

Solder alloys for photonic packaging applications include indium, gold, bismuth, cadmium and gallium based solder alloys. Please click on any of the above metals to display additional information on their alloys.

The chart below lists a selection of AIM's most commonly specified solder alloys used in photonic packaging applications.
一般属性

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物料形态
已商用:当前有效
文档
description

Technical Datasheet (English)

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可用性
北美洲
其他属性
Metal Type, Type Analysis, 密度, Tensile Strength (Yield), 0.2%, Mean CTE
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加工

Find specific processing information for AIM Specialty as well as general information for the Tin - Cast - Alloy generic family. 注册 登录 了解更多信息。

购买地点

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