BAM Tungsten-Copper for Heat Sinks WCu25 数据表

Wrought Tungsten Alloy

用Beijing Advanced Materials Co., Ltd.提供

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产品说明
As high performance materials, Tungsten-Copper and Molybdenum-Copper Alloys are characterized by high thermal conductivity, low thermal expansion and high wear resistance combined with excellent electrical conductivity. It is very important to indicate which following grade is for your application, Heat Sink Grade or Electrode Grade.

Electronic Applications
Heat Sinks and Spreaders, Microwave Carriers, Hermetic Package Bases and Housings, Ceramic Substrate Carriers, GaAs and Silicon Device Mounts, Laser Diode Mounts.
总览  
材料状态 
  • 已商用:当前有效
供货地区 
  • 亚太地区
  • 北美洲
  • 欧洲
Available Documents
Technical Datasheet (English)
Metals General
额定值
单位制
 
Forms Available
 
 
Metal Type
 
 
Metals Type Analysis
额定值
单位制
 
Type Analysis
     
Copper
%
 
Tungsten
%
 
Metals Physical
额定值
单位制
 
密度
lb/in³
 
Metals Thermal
额定值
单位制
 
Mean CTE
in/in/°F
 
导热系数
Btu·in/hr/ft²/°F
 
备注
1一般属性:这些不能被视为规格。
 
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此数据表中的信息由 UL Prospector 从该材料的生产商处获得。UL Prospector 尽最大努力确保此数据的准确性。 但是 UL Prospector 对这些数据值不承担任何责任,并强烈建议在最终选择材料前,就数据值与材料供应商进行验证。