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HPM® Beryllium Copper 25

通用系列: Copper - Wrought - High-Copper Alloy提供方: Hamilton Precision Metals
Beryllium Copper 25 is a Copper base alloy with the capability of being strengthened by precipitation heat treatment. The alloy furnishes the best combination of electrical conductivity, corrosion resistance and mechanical strength necessary for numerous electronic and electro-mechanical devices.
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物料形态
已商用:当前有效
文档
description

Technical Datasheet (English)

下载文档
可用性
北美洲, 欧洲, 亚太地区
其他属性
Applicable Specifications, Forms Available, Metal Type, Alloy Identification, Type Analysis, 密度, Tensile Strength (Ultimate), Tensile Strength (Yield), 0.2%, Tensile Elongation (Break), 泊松比, 拉伸模量, Mean CTE, 导热系数, Electrical Resistivity, Electrical Conductivity
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加工

Find specific processing information for HPM® as well as general information for the Copper - Wrought - High-Copper Alloy generic family. 注册 登录 了解更多信息。

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