Osprey CE7
Typical uses include high performance device, circuit and system level packages for applications in defence, aerospace, space, communications, radar and other leading-edge industries.
The materials are produced using Sandvik Osprey's patented rapid solidification spray forming technology, which has been used for the manufacture of many advanced materials over the past 25 years.
Typical Applications
- Microwave/RF Housings
- Hermetic Packages
- Power Baseplates
- Carriers
- Metal-clad PCBs
- PCB Guide Bars
- Assembly Fixtures for Soldering
- Structural Components
一般属性
使用 Prospector 建立免費帳戶時,可造訪 Osprey CE7 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
Technical Datasheet (English)
下载文档加工
Find specific processing information for Osprey as well as general information for the Silicon - Cast - Alloy generic family. 注册 或 登录 了解更多信息。