HARRIS® DYNAFLOW®

Generic Family: Copper - Wrought - Cu-Ag-P Alloy • Supplied by: THE HARRIS PRODUCTS GROUP

Designed for copper or brass applications, Dynaflow is self fluxing on copper but requires use of Stay-Silv® white or black brazing flux when joining brass. Dynaflow mirrors the brazing characteristics of Stay-Silv 15. The melting range is wide enough to alloy filling gaps, necessary to braze loose connections or "cap" a finished joint. When heated to its liquidus temperature the filler metal flows quickly to fill tight gaps or standard connections.

AVAILABLE FORMS:
Standard wire diameters in 20" or 36" lengths, on layer wound spools, formed rings

RECOMMENDED FLUX:
No flux required on copper
Stay Silv white or black brazing flux with brass

General Properties

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Material Status

Commercial: Active

Documents

Technical Datasheet (English)

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Availability

North America

Other Properties

Forms Available, Metal Type, Type Analysis, Tensile Strength (Ultimate), Tensile Elongation (Break), Electrical Resistivity, Electrical Conductivity

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Processing

Find specific processing information for HARRIS® as well as general information for the Copper - Wrought - Cu-Ag-P Alloy generic family. Register or Sign In for more information.