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HPM® Beryllium Copper 25

Generic Family: Copper - Wrought - High-Copper AlloySupplied by: Hamilton Precision Metals
Beryllium Copper 25 is a Copper base alloy with the capability of being strengthened by precipitation heat treatment. The alloy furnishes the best combination of electrical conductivity, corrosion resistance and mechanical strength necessary for numerous electronic and electro-mechanical devices.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Asia Pacific, Europe, North America
Other Properties
Applicable Specifications, Forms Available, Metal Type, Alloy Identification, Type Analysis, Density, Tensile Strength (Ultimate), Tensile Strength (Yield), 0.2%, Tensile Elongation (Break), Poisson's Ratio, Tensile Modulus, Mean CTE, Thermal Conductivity, Electrical Resistivity, Electrical Conductivity
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Processing

Find specific processing information for HPM® as well as general information for the Copper - Wrought - High-Copper Alloy generic family. Register or Sign In for more information.

Where To Buy

You can purchase HPM® Beryllium Copper 25 from 1 distributors or manufacturers. Register or Sign In for more information.

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