This series of composites - Molybdenum-Copper and Tungsten-Copper - developed by AMETEK using its wrought powder metallurgy technology, has unique properties for use in: heat sinks, substrates, and thermal spreaders.

The material is available as finished parts with the following maximum dimensions depending on overall size:

• Width: 6 inches (152 mm)

• Thickness: 0.250 inches (6.4 mm)

• Length: 24 inches (610 mm)

These composites of molybdenum-copper and tungsten-copper have many applications in electronic devices. The excellent thermal conductivity and low thermal expansion makes them ideal for:

• Chip mounting

• Heat sinks

• Circuit board cores

• Lids or covers

• Thermal spreaders

The material can be machined into shapes and readily plated if required.

AMETEK's wrought powder metallurgy composites have superior through-thickness thermal conductivity versus other products.