NanoTach® X Series
Product Description
Thick paste of nano-sized silver powder in an organic binder formulation.
Key Features
Applications
Bonding small to large chips (over 10mm x 10mm) for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, RF power devices.
Thick paste of nano-sized silver powder in an organic binder formulation.
Key Features
- Uniform dispersion for screen/stencil printing or dispensing
- Low sintering temperature (<260 °C)
- Excellent sintered properties
- RoHS compliant
Applications
Bonding small to large chips (over 10mm x 10mm) for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, RF power devices.
General Properties
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Material Status
Commercial: Active
Documents
description
Technical Datasheet (English)
Download DocumentAvailability
North America
Other Properties
Forms Available, Metal Type, Density, Tensile Modulus, Mean CTE, Thermal Conductivity, Electrical Resistivity
Processing
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Where To Buy
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