AIM Specialty 58Bi/42Sn Datasheet

Wrought Bismuth Alloy

Supplied by AIM Specialty Materials

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Product Description
Solders for Photonic Packaging

AIM's full range of specialty joining materials includes indium and gold/tin solders for photonic packaging applications. When you work with AIM you receive superior products & the technical support you need to produce innovative and reliable packaging solutions. AIM offers a broad range of solders to fulfill your most challenging component packaging applications. We offer solders for:

  • Fiber to Ferrule Soldering
  • Laser Die Attach
  • Hermetic Packaging & Sealing
  • Wetting & Sealing Laser Optics
  • Thermal Management

Solder alloys for photonic packaging applications include indium, gold, bismuth, cadmium and gallium based solder alloys. Please click on any of the above metals to display additional information on their alloys.

The chart below lists a selection of AIM's most commonly specified solder alloys used in photonic packaging applications.
General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Available Documents
Technical Datasheet (English)
Metals General
Nominal Value
Unit
 
Metal Type
 
 
Metals Type Analysis
Nominal Value
Unit
 
Type Analysis
     
Bismuth
%
 
Tin
%
 
Metals Physical
Nominal Value
Unit
 
Density
lb/in³
 
Metals Mechanical
Nominal Value
Unit
 
Tensile Strength (Yield), 0.2%
ksi
 
Metals Thermal
Nominal Value
Unit
 
Mean CTE
in/in/°F
 
Notes
1Typical properties: these are not to be construed as specifications.
 
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