AIM Specialty 70In/30Pb Datasheet

Cast Indium Alloy

Supplied by AIM Specialty Materials

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Product Description
Solders for Photonic Packaging

AIM's full range of specialty joining materials includes indium and gold/tin solders for photonic packaging applications. When you work with AIM you receive superior products & the technical support you need to produce innovative and reliable packaging solutions. AIM offers a broad range of solders to fulfill your most challenging component packaging applications. We offer solders for:

  • Fiber to Ferrule Soldering
  • Laser Die Attach
  • Hermetic Packaging & Sealing
  • Wetting & Sealing Laser Optics
  • Thermal Management

Solder alloys for photonic packaging applications include indium, gold, bismuth, cadmium and gallium based solder alloys. Please click on any of the above metals to display additional information on their alloys.

The chart below lists a selection of AIM's most commonly specified solder alloys used in photonic packaging applications.
Material Status 
  • Commercial: Active
  • North America
Available Documents
Technical Datasheet (English)
Metals General
Nominal Value
Metal Type
Metals Type Analysis
Nominal Value
Type Analysis
Metals Physical
Nominal Value
Metals Mechanical
Nominal Value
Tensile Strength (Yield), 0.2%
Metals Thermal
Nominal Value
Mean CTE
1Typical properties: these are not to be construed as specifications.
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